PCB Services
PCB Fabrication Services
From bare board fabrication to complex HDI and specialty constructions.
AstroPCB’s fabrication capabilities span the full range of printed circuit board constructions — from single-layer aluminum-backed LED boards to 40-layer HDI boards with sequential lamination on Megtron 7 laminate. This page summarizes the fabrication parameters, materials and construction types available. For specific technical questions about whether a particular construction is feasible, contact the engineering team with your design files for a DFM assessment.
Layer count and construction
Single-sided, double-sided, and multilayer PCBs from 1 to 40+ layers. Standard multilayer construction with through-hole vias. HDI construction with laser-drilled microvias (blind vias from outer layers to adjacent inner layers), buried vias (connecting inner layers without reaching outer surfaces), and stacked microvias (2-3 levels of laser vias stacked vertically). Sequential lamination with up to 7 build-up cycles for the most complex HDI designs. Rigid, flex, and rigid-flex constructions.
Materials
Standard FR-4: Shengyi S1141, Kingboard KB-6160 (Tg 130-140°C). Mid-Tg FR-4: Tg 150-170°C for lead-free assembly. High-Tg FR-4: Isola 370HR, Shengyi S1000-2M (Tg 180°C, Td 340°C) for automotive, industrial and high-reliability applications. Low-loss: Isola FR408HR, Panasonic Megtron 4 for moderate high-speed digital. Ultra-low-loss: Panasonic Megtron 6 (Df 0.004), Megtron 7 (Df 0.002) for 56G/112G PAM4 data center and AI applications. RF: Rogers RO4350B, RO4003C for 1-20 GHz. PTFE: Rogers RT/duroid 5880, 6002 for millimeter-wave and ultra-low-loss applications. Polyimide: for flex, rigid-flex and high-temperature applications. Ceramic: Al₂O₃, AlN for thermal management and high-power RF. Metal core: aluminum and copper base for LED and power electronics.
Mechanical parameters
Board thickness: 0.2 mm to 6.0 mm. Copper weight: 0.5 oz (17 µm) to 10 oz (350 µm). Minimum trace width: 3 mil (75 µm) standard, 2 mil (50 µm) HDI. Minimum trace space: 3 mil standard, 2 mil HDI. Minimum mechanical drill: 0.15 mm (6 mil). Minimum laser drill: 0.1 mm (4 mil). Maximum board size: 580 x 480 mm (standard panel). Aspect ratio: up to 12:1 for through-hole vias. Tolerance: ±0.1 mm outline, ±3 mil registration standard, ±2 mil HDI.
Surface finishes
HASL (hot air solder leveling) — tin-lead or lead-free. ENIG (electroless nickel immersion gold) — 3-5 µm Ni, 0.05-0.1 µm Au. ENEPIG (electroless nickel electroless palladium immersion gold) — for wire bonding and mixed-finish applications. Immersion silver — flat surface, good solderability, moderate shelf life. Immersion tin — flat surface, limited shelf life. OSP (organic solderability preservative) — lowest cost, shortest shelf life. Hard gold — 0.5-2.0 µm for edge connectors and contact surfaces.
Impedance control
Controlled impedance to ±8% (±5% available for critical applications). 2D field solver modeling using actual laminate Dk data from the material lot. TDR (Time Domain Reflectometry) measurement on impedance coupons that travel with the production panel. Single-ended impedance targets from 28 to 100 ohms. Differential impedance targets from 70 to 120 ohms.
Request a fabrication quote
Upload your design files with stackup and impedance requirements. The engineering team will review for manufacturability and return a quotation within one business day.