AstroPCB · PCB Capabilities
PCB Capabilities: Vias, Impedance, Heavy Copper & Finishes
Four core process capabilities behind our boards: special vias (laser drilling, blind and buried vias, via in pad), controlled impedance, heavy copper and surface finishes.
Capability overview
PCB manufacturing capabilities at a glance.
| Parameter | AstroPCB capability | Details |
|---|---|---|
| Layer count | 1 to 30 layers | Multilayer PCB |
| Board thickness | 0.2–6.0 mm (±10% standard) | PCB fabrication |
| Max. board size | 580 × 700 mm | PCB fabrication |
| Min. line / space | 50 / 50 µm | HDI PCB |
| Min. mechanical drill | 0.10 mm | PCB fabrication |
| Min. laser drill | 75 µm; aspect ratio up to 1:1 | Laser drilling |
| Blind & buried vias | Up to 7 sequential laminations; stacked or staggered microvias | Blind & buried vias |
| Via in pad | Filled and copper-capped (VIPPO), IPC-4761 Type VII | Via in pad |
| Controlled impedance | ±8% with field-solver modeling and TDR coupons | Controlled impedance |
| Copper weight | 0.5–10 oz | Heavy copper |
| Surface finishes | HASL, lead-free HASL, ENIG, ENEPIG, immersion silver / tin, OSP, hard gold | Surface finish |
| Test & quality | 100% electrical test (flying probe or fixture); IPC-6012 Class 2 default, Class 3 on request | Certifications |
Jump to vias, impedance control, heavy copper or surface finish.
PCB Capabilities
Vias
Laser drilling, blind & buried vias and via in pad.
Blind & buried vias
Blind, buried and microvia spans by sequential lamination.
Learn morePCB Capabilities
Impedance control
Signal integrity, modeled and measured.
Plan it first with the free impedance calculator and stack-up calculator.
PCB Capabilities
Heavy copper
Current capacity and heat spreading.
Size conductors with the trace width calculator.
PCB Capabilities
Surface finish
Solderability, bonding and shelf life.
Looking for a board type such as HDI, multilayer, rigid-flex or RF? See all PCB manufacturing services, or check our certifications.
FAQ
Questions.
What are AstroPCB’s standard PCB manufacturing capabilities?
1–30 layers, 0.2–6.0 mm board thickness, 50 µm line and space, 0.10 mm minimum mechanical drill, 75 µm minimum laser drill, 0.5–10 oz copper and ±8% controlled impedance.
Which special via processes do you offer?
Laser-drilled microvias, blind and buried vias (including stacked and staggered microvias), and filled and capped via in pad.
What is the most advanced HDI structure you build?
Up to 7 sequential laminations with stacked microvias and copper-filled via in pad.
Which surface finishes are available?
HASL, lead-free HASL, ENIG, ENEPIG, immersion silver, immersion tin, OSP and hard gold.
How do I confirm my design fits these capabilities?
Upload your files for a quote. Every quote includes a free pre-review against these limits, and a full engineering DFM is performed before fabrication.
Ready when your files are
Start with an engineering-reviewed quote.
Upload Gerber, ODB++ or IPC-2581 data. Every quote includes a written DFM review.