AstroPCB
PCB Manufacturing Capabilities
Full-spectrum fabrication from standard multilayer to advanced HDI and rigid-flex.
AstroPCB’s manufacturing capabilities cover the full range of PCB construction types — from standard multilayer FR-4 boards to advanced HDI, rigid-flex, RF and specialty substrate constructions. This page provides an overview of each capability area. Select a specific capability for detailed technical information, design guidelines and specifications.
HDI PCB
High Density Interconnect boards with laser-drilled microvias, blind and buried vias, sequential lamination up to 7 build-up cycles, and stacked microvias for fine-pitch BGA escape routing. HDI enables higher routing density in fewer layers.
Rigid-Flex PCB
Integrated rigid and flexible sections in a single board. Polyimide flex zones replace connectors and cables. Up to 20 rigid layers with 4 flex layers. Controlled impedance through rigid and flex zones.
Flex PCB
Single-sided, double-sided and multilayer flexible circuits on polyimide substrates. Static and dynamic flex applications. Rolled annealed copper for maximum flex endurance. Coverlay and stiffener options.
Multilayer PCB
4 to 40+ layer constructions with controlled impedance, standard and specialty laminates, and optimized stackup design for signal integrity and power delivery.
RF PCB
RF and microwave boards on Rogers, PTFE and hybrid stackups. Controlled impedance with TDR verification. Applications from UHF through millimeter-wave frequencies.
Metal Core & Aluminum PCB
Aluminum and copper core substrates for LED lighting, power electronics and thermal management applications. Single and double-sided constructions with high-conductivity dielectrics.
Aluminum PCB → · Metal Core PCB →
Ceramic PCB
Al₂O₃, AlN and LTCC substrates for high-power, high-temperature and hermetic packaging applications. Thick-film, thin-film and DBC metallization.
Additional Capabilities
Blind & Buried Vias · Heavy Copper · Full Fabrication Specifications →