AstroPCB Capability
Blind and Buried Via PCB Capability
Blind and buried vias add routing freedom to dense boards, but they also define the lamination sequence and fabrication complexity. They should be chosen where the routing and stack-up benefit is clear.
Engineering focus
Blind and buried vias add routing freedom to dense boards, but they also define the lamination sequence and fabrication complexity. They should be chosen where the routing and stack-up benefit is clear.
- Blind-via and buried-via placement in the stack-up
- Sequential lamination and drilling implications
- Electrical and reliability considerations for dense routing
What to include in your RFQ
Useful manufacturing reviews begin with the actual fabrication data and the requirements that cannot move. Include the current Gerber, ODB++ or IPC-2581 package, fabrication drawing, quantities, target delivery and any electrical, thermal, material or documentation constraints.
- Current fabrication data and stack-up intent
- Relevant design-rule, test and reliability requirements
- Quantities, schedule and assembly context
Related engineering resources
HDI PCB Manufacturer
Review HDI construction options.
Multilayer PCB
Plan a complex multilayer stack-up.
Microvia
Compare HDI interconnect options.
Move the project forward
Share the available design package and the decisions still open. AstroPCB will help frame a practical manufacturing path before release.
AstroPCB-published capability data · Updated September 18, 2026
Engineering capability snapshot
These are published engineering reference points for quotation and early design planning. Final construction, tolerances and producibility are confirmed through DFM review against the actual stack-up, material, copper distribution and quantity.
| Capability | Published reference |
|---|---|
| HDI build-up | Up to 7-step HDI; stacked or staggered microvia strategies reviewed by DFM. |
| Heavy copper | Up to 10 oz copper for suitable FR-4 heavy-copper constructions. |
| Fine features | Published quotation range reaches 3 mil line/space and 0.10 mm mechanical drill, subject to construction review. |
| Impedance control | Controlled-impedance options to ±8%, with stack-up confirmation required. |
| Via and finish options | Epoxy-filled and capped vias; HASL, lead-free HASL, ENIG, hard gold, immersion silver, immersion tin and ENEPIG options. |
Blind and buried vias in complex builds
Blind and buried vias are reviewed alongside the HDI step count and lamination sequence. Their value is in solving a specific routing or layer-transition problem, while keeping the build sequence realistic.
- Show the start and stop layers for every blind or buried via type.
- Keep the via schedule connected to the proposed stack-up and sequential lamination plan.
- Call out impedance-sensitive transitions so the fabrication and signal-integrity review can be coordinated.