Rogers PCB Laminates

PCB Materials

Rogers PCB Laminates

Complete guide to Rogers RO4000 and RT/duroid laminate families.

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Rogers Corporation manufactures the most widely specified RF and microwave PCB laminates in the industry. The Rogers product line spans from FR-4-processable hydrocarbon/ceramic composites (RO4000 series) to ultra-low-loss PTFE-based substrates (RT/duroid series) to high-frequency laminates engineered for specific applications (RO3000, TMM series). AstroPCB stocks and fabricates boards on the full range of Rogers laminates with controlled impedance verified by TDR measurement.

RO4000 Series — FR-4 Compatible RF Laminates

The RO4000 series uses a glass-reinforced hydrocarbon/ceramic composite that processes on standard FR-4 fabrication equipment — no special drilling, plating or lamination procedures required. This processing compatibility makes RO4000 the most cost-effective Rogers material family and the default choice for RF PCBs when Df in the 0.003-0.004 range meets the performance requirement.

RO4350B (Dk 3.48, Df 0.0037 at 10 GHz): the highest-volume Rogers laminate. Specified for antenna feed networks, bandpass filters, couplers, power dividers, low-noise amplifier matching and general RF interconnects from 1 to 20 GHz. Available in standard core thicknesses from 6.6 to 60 mil. UL 94 V-0 rated.

RO4003C (Dk 3.38, Df 0.0027 at 10 GHz): 25% lower loss than RO4350B. Specified when the additional performance margin is needed to close a tight link budget — receiver front ends with stringent noise figure requirements, long RF interconnects, cascaded filter banks. Higher cost and fewer standard thicknesses than RO4350B.

Both RO4350B and RO4003C provide excellent Dk stability over temperature (TCDk ~40 ppm/°C) and frequency, low moisture absorption (0.06%), and compatibility with lead-free assembly processes.

Rogers 4350B Details → · Rogers 4003C Details →

RT/duroid Series — PTFE-Based Laminates

The RT/duroid series uses PTFE-based substrates with glass or ceramic fillers for the lowest available dielectric loss. These laminates are specified for applications above 20 GHz, satellite communications, radio astronomy, precision test equipment and any RF path where every fraction of a dB matters.

RT/duroid 5880 (Dk 2.20, Df 0.0009 at 10 GHz): glass-reinforced PTFE with the lowest loss in the duroid family. The standard choice for millimeter-wave antenna elements, filter substrates and receiver front-end circuits. The low Dk of 2.2 results in wider traces for a given impedance, reducing conductor loss and easing fabrication tolerance.

RT/duroid 6002 (Dk 2.94, Df 0.0012 at 10 GHz): ceramic-filled PTFE providing a higher Dk for more compact circuit dimensions while maintaining very low loss. Used in radar and electronic warfare modules where board real estate is constrained.

PTFE laminates require specialized fabrication: modified drilling parameters, surface preparation (sodium etching) for bonding, and PTFE-qualified plating processes. AstroPCB’s production line includes PTFE-qualified processes for both all-PTFE and hybrid PTFE/FR-4 constructions.

Hybrid Rogers/FR-4 Stackups

Many RF products combine a Rogers RF front end with FR-4 digital and power circuits on a single board. A hybrid stackup places Rogers laminate on the RF signal layers and FR-4 on the remaining layers, bonded with compatible prepreg materials. This approach optimizes performance and cost — expensive Rogers material only where the RF performance demands it. The engineering team validates hybrid stackup constructions for bondability, CTE compatibility and impedance accuracy across the dissimilar materials.

Rogers PCB Manufacturing at AstroPCB

AstroPCB stocks RO4350B and RO4003C in standard thicknesses for fast-turn fabrication. RT/duroid and other Rogers materials are available on order with lead times confirmed during quotation. Controlled impedance to ±8% with TDR verification. DFM review for every Rogers PCB order ensures that the material selection, stackup and fabrication process produce the intended RF performance.

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Specify the Rogers material, core thickness, layer count and impedance targets. Upload design files for an engineering-reviewed quotation.

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