AstroPCB Capability
Heavy Copper PCB Capability for High-Current Designs
Heavy copper PCB construction supports high-current paths and thermal loads that require more than standard copper weights. Trace geometry, plating, etch compensation and assembly conditions all influence the final design rules.
Engineering focus
Heavy copper PCB construction supports high-current paths and thermal loads that require more than standard copper weights. Trace geometry, plating, etch compensation and assembly conditions all influence the final design rules.
- Heavy and thick copper PCB construction
- Current carrying, thermal and etch-compensation planning
- Layer-to-layer transitions and thermal-relief choices
What to include in your RFQ
Useful manufacturing reviews begin with the actual fabrication data and the requirements that cannot move. Include the current Gerber, ODB++ or IPC-2581 package, fabrication drawing, quantities, target delivery and any electrical, thermal, material or documentation constraints.
- Current fabrication data and stack-up intent
- Relevant design-rule, test and reliability requirements
- Quantities, schedule and assembly context
Related engineering resources
Power Electronics PCB
See a high-current application.
Metal Core PCB
Explore thermal construction choices.
Trace Width Calculator
Estimate an initial external trace width.
Move the project forward
Share the available design package and the decisions still open. AstroPCB will help frame a practical manufacturing path before release.
AstroPCB-published capability data · Updated September 18, 2026
Engineering capability snapshot
These are published engineering reference points for quotation and early design planning. Final construction, tolerances and producibility are confirmed through DFM review against the actual stack-up, material, copper distribution and quantity.
| Capability | Published reference |
|---|---|
| HDI build-up | Up to 7-step HDI; stacked or staggered microvia strategies reviewed by DFM. |
| Heavy copper | Up to 10 oz copper for suitable FR-4 heavy-copper constructions. |
| Fine features | Published quotation range reaches 3 mil line/space and 0.10 mm mechanical drill, subject to construction review. |
| Impedance control | Controlled-impedance options to ±8%, with stack-up confirmation required. |
| Via and finish options | Epoxy-filled and capped vias; HASL, lead-free HASL, ENIG, hard gold, immersion silver, immersion tin and ENEPIG options. |
10 oz heavy-copper PCB construction
AstroPCB can review FR-4 heavy-copper designs up to 10 oz. The final design rules depend on copper distribution, minimum spacing, thermal relief, plated features, finished thickness and current-carrying requirements.
- Provide current paths, power dissipation and ambient-temperature information.
- Identify copper weights by layer and any high-current connector or component interfaces.
- Expect DFM review of etch compensation, clearance, drilling and assembly implications before release.