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HDI PCB Design Guidelines: From Stackup Planning to Microvia Optimization
High Density Interconnect (HDI) PCB design demands a different approach than conventional multilayer layout. With microvia diameters below 100μm, trace widths under 3 mil, and sequential lamination adding layers of manufacturing complexity, every design decision has a direct impact on yield, cost, and signal performance. This guide covers the practical engineering decisions that separate a…