Industries
AI & Data Center PCB
High layer count, Megtron 7/8, HDI for 56G/112G PAM4 signaling.
AI accelerators, GPU compute modules, network switches and data center infrastructure boards represent some of the most technically demanding PCBs in production. These boards combine high layer counts (20-40+ layers), ultra-low-loss laminates (Megtron 7/8), high-density interconnect features (microvias, via-in-pad, sequential lamination), controlled impedance for 56G/112G PAM4 signaling, and massive power delivery networks — all in a single construction. AstroPCB manufactures AI server PCBs and data center boards with the layer count, laminate and impedance control capabilities these designs demand.
Signal integrity at 56G and beyond
Modern AI accelerator interconnects operate at 56 Gbps PAM4 today, with 112G PAM4 and 224G PAM4 on the near-term roadmap. At these data rates, the PCB laminate is the dominant contributor to channel insertion loss. Standard FR-4 is unusable. Megtron 6 may be marginal for longer channels. Megtron 7 is the current baseline for 56G designs, and Megtron 8 is specified for 112G and emerging 224G applications.
Copper roughness matters as much as laminate loss at these frequencies. HVLP (Hyper Very Low Profile) or RVLP (Reverse Very Low Profile) copper foil is specified for signal layers to minimize roughness-related insertion loss. The difference between standard copper and HVLP copper can be 1-2 dB per inch at 28 GHz — the Nyquist frequency for 56G PAM4 — which directly determines whether a channel passes or fails compliance testing.
High layer count construction
AI server PCBs and switch boards commonly require 20 to 40 or more layers to accommodate the routing density of hundreds of high-speed SerDes lanes, memory interfaces, power distribution planes and miscellaneous I/O. These boards use sequential lamination with blind and buried vias to connect signal layers without consuming routing real estate with through-hole vias. HDI features — laser-drilled microvias, stacked vias, via-in-pad — enable the fine-pitch BGA escape routing required by processors and ASICs with 2,000+ ball counts.
Power delivery
A modern AI accelerator can draw 300-700 watts. Delivering this power from the board edge (where VRM modules connect) to the processor requires heavy copper planes (2-4 oz on power layers), low-impedance PDN (power delivery network) design and careful via placement to minimize voltage drop. The power delivery design interacts with the signal integrity design — heavy copper planes change the stackup geometry and affect impedance on adjacent signal layers. Both aspects must be co-designed during stackup planning.
Thermal management
With hundreds of watts dissipated in a small area, thermal management is integral to the PCB design. Thermal via arrays beneath high-power components conduct heat from the surface to internal copper planes. These planes spread heat laterally to the board edges where it is removed by the system cooling (airflow, cold plates or liquid cooling). The thermal via pattern, copper plane coverage and board-to-heatsink interface all affect the thermal resistance from junction to ambient.
Request an AI/data center PCB quote
Specify layer count, laminate grade (Megtron 6/7/8), impedance targets, copper weights and any HDI features. Upload design files for engineering review and quotation.