Heavy Copper PCB
Heavy Copper PCB Manufacturing
Heavy-copper construction is often driven by current-carrying capacity, heat management and the mechanical implications of thicker copper features.
Built around the details that shape the board
Heavy-copper construction is often driven by current-carrying capacity, heat management and the mechanical implications of thicker copper features.
- Target copper weight by layer and finished copper intent
- Trace geometry, current path and thermal considerations
- Drill, plating and clearance requirements
- Assembly and solder-joint considerations around heavy features
Plan the manufacturing review
Start with the fabrication data, mechanical requirements, material intent, expected quantity and schedule. Calling out the constraints early makes it easier to align the board construction, test path and documentation with the program.
- A copper construction brief linked to electrical and thermal objectives
- Clearer review points for etch, plating and geometry
- A quote package that exposes the high-current priorities
Related engineering resources
Copper Thickness Guide
Understand copper planning questions.
BMS / Power PCB
Explore a power-electronics context.
Move your project forward
Share the current design package and the requirements that matter most. AstroPCB will use that information to frame an engineering-led manufacturing discussion.
AstroPCB-published capability data · Updated September 18, 2026
Engineering capability snapshot
These are published engineering reference points for quotation and early design planning. Final construction, tolerances and producibility are confirmed through DFM review against the actual stack-up, material, copper distribution and quantity.
| Capability | Published reference |
|---|---|
| HDI build-up | Up to 7-step HDI; stacked or staggered microvia strategies reviewed by DFM. |
| Heavy copper | Up to 10 oz copper for suitable FR-4 heavy-copper constructions. |
| Fine features | Published quotation range reaches 3 mil line/space and 0.10 mm mechanical drill, subject to construction review. |
| Impedance control | Controlled-impedance options to ±8%, with stack-up confirmation required. |
| Via and finish options | Epoxy-filled and capped vias; HASL, lead-free HASL, ENIG, hard gold, immersion silver, immersion tin and ENEPIG options. |
10 oz heavy-copper PCB construction
AstroPCB can review FR-4 heavy-copper designs up to 10 oz. The final design rules depend on copper distribution, minimum spacing, thermal relief, plated features, finished thickness and current-carrying requirements.
- Provide current paths, power dissipation and ambient-temperature information.
- Identify copper weights by layer and any high-current connector or component interfaces.
- Expect DFM review of etch compensation, clearance, drilling and assembly implications before release.