AstroPCB Capability
Microvia PCB Capability for HDI Interconnect
Microvias are a central HDI interconnect decision. Their diameter, stacking, pad geometry and adjacent material system should be reviewed together with the routing density and reliability expectations.
Engineering focus
Microvias are a central HDI interconnect decision. Their diameter, stacking, pad geometry and adjacent material system should be reviewed together with the routing density and reliability expectations.
- Laser-via geometry and aspect-ratio planning
- Stacked, staggered and filled-via strategy
- Relationship between microvias, pad design and sequential build-up
What to include in your RFQ
Useful manufacturing reviews begin with the actual fabrication data and the requirements that cannot move. Include the current Gerber, ODB++ or IPC-2581 package, fabrication drawing, quantities, target delivery and any electrical, thermal, material or documentation constraints.
- Current fabrication data and stack-up intent
- Relevant design-rule, test and reliability requirements
- Quantities, schedule and assembly context
Related engineering resources
HDI PCB Manufacturer
Apply microvia choices to an HDI build.
Via in Pad
Review a common fine-pitch interconnect method.
Megtron Materials
Explore high-performance laminate options.
Move the project forward
Share the available design package and the decisions still open. AstroPCB will help frame a practical manufacturing path before release.
AstroPCB-published capability data · Updated September 18, 2026
Engineering capability snapshot
These are published engineering reference points for quotation and early design planning. Final construction, tolerances and producibility are confirmed through DFM review against the actual stack-up, material, copper distribution and quantity.
| Capability | Published reference |
|---|---|
| HDI build-up | Up to 7-step HDI; stacked or staggered microvia strategies reviewed by DFM. |
| Heavy copper | Up to 10 oz copper for suitable FR-4 heavy-copper constructions. |
| Fine features | Published quotation range reaches 3 mil line/space and 0.10 mm mechanical drill, subject to construction review. |
| Impedance control | Controlled-impedance options to ±8%, with stack-up confirmation required. |
| Via and finish options | Epoxy-filled and capped vias; HASL, lead-free HASL, ENIG, hard gold, immersion silver, immersion tin and ENEPIG options. |
Microvias within a 7-step HDI strategy
Microvias are assessed as part of the full HDI build-up, including laser-drill targets, pad geometry, stacking sequence and the fill/cap requirements of nearby assembly pads.
- Document whether the microvia structure is stacked or staggered.
- Identify any epoxy-filled and capped locations used for fine-pitch assembly.
- Provide the intended stack-up and electrical requirements before finalising the microvia geometry.